High-Precision Single-Side Polishing Equipment for Si Wafers/SiC/Sapphire Materials
High-precision single-side polishing equipment is a specialized precision machining tool designed for hard and brittle materials (e.g., semiconductor silicon wafers, silicon carbide, gallium arsenide, sapphire, quartz, ceramics). Through unidirectional rotational grinding and chemical synergy, it achieves ultra-high surface finishing with flatness ≤0.01 mm and surface roughness Ra ≤0.4 nm. This equipment is widely used in semiconductor wafer thinning, optical lens polishing, ceramic sealing component processing, and supports both single-piece and batch processing, significantly enhancing efficiency and consistency.
High-Precision Single-Side Polishing Equipment Technical Parameters
| Categories |
Item |
| Polluting disk |
Diameter |
820 (mm) |
914 (mm) |
1282 (mm) |
1504 (mm) |
| Ceramic Plates |
Diameter |
305 (mm) |
360 (mm) |
485 (mm) |
576 (mm) |
| |
Optimum Machining Size |
50-100 (mm) |
50-150 (mm) |
150-200 (mm) |
200 (mm) |
| Power |
Polluting disk |
11 |
11 |
18.5 |
30 |
| |
Polluting tool |
/ |
0.75×4 |
2.2×4 |
2.2 |
| Rotation rate |
Polluting disk |
80 |
65 |
65 |
50 |
| |
Polluting tool |
/ |
65 |
65 |
50 |
| Ability |
50mm |
72 |
/ |
/ |
/ |
| |
100mm |
20 |
28 |
56 |
/ |
| |
150mm |
/ |
12 |
24 |
/ |
| |
200mm |
/ |
4 |
12 |
20 |
| Power voltage |
3×16+2*10 (㎜²) |
| Compressed air source |
0.5-0.6MPa |
| Size |
/ |
1920×1125×1680 (mm) |
1360×1330×2798 (mm) |
2234×1780×2759 (mm) |
1900×1900×2700 (mm) |
| Weight |
/ |
2000kg |
3500kg |
7500kg |
11826kg |
High-Precision Single-Side Polishing Equipment Working Principles
1. Mechanical Grinding:
- The upper polishing disc rotates at 0–90 RPM (adjustable), combined with abrasives (diamond, silicon carbide) to friction-polish the workpiece surface, removing oxidation layers and micro-defects.
2. Pressure Control:
- Electro-pneumatic proportional valves and cylinders enable precise pressure adjustment (15–1500 kg), adapting to varying material hardness.
3. Cooling & Lubrication:
- A recirculating cooling water system (0.1–0.2 MPa) maintains a constant temperature (10–25°C) to suppress thermal deformation while delivering polishing slurry for enhanced material removal.
4. Motion Control:
- Variable frequency motor drives the lower disc rotation. PLC and HMI enable closed-loop control of speed, pressure, and time parameters, with preset process recipes and one-click switching.
High-Precision Single-Side Polishing Equipment Features
|
Feature Category
|
Technical Details
|
|
High-Rigidity Frame
|
Integrated casting-forging structure, 50% higher anti-deformation capability; four-point hydraulic support system ensures vibration <0.01 mm at high speeds.
|
|
International Components
|
Core parts (e.g., gearboxes, bearings) use Germany SEW, Japan THK, Switzerland SKF, achieving <0.005 mm transmission accuracy; Siemens PLC + Schneider inverter for 0–180 RPM stepless speed regulation.
|
|
Smart Interface
|
10-inch industrial touchscreen supports preset recipes (rough polishing, fine polishing, disc repair), real-time monitoring (pressure/temperature/speed), and automatic shutdown alarms (defect rate <0.05%).
|
|
Flexible Configuration
|
Polishing disc sizes from φ300 mm to φ1900 mm, accommodating workpieces 3–1850 mm; power options from single motor (7.5 kW) to multi-motor (30 kW total), supporting vacuum suction and mechanical clamping.
|
High-Precision Single-Side Polishing Equipment Applications
1. Semiconductor Industry:
- Wafer Thinning: Silicon carbide wafer thinning with ±0.5 μm thickness tolerance for 8-inch wafers.
- Gallium Arsenide/Blue Sapphire Polishing: Surface roughness Ra <0.4 nm for LEDs and laser devices.
2. Optics & Precision Devices:
- Optical Glass/Quartz Lenses: Mirror-like finish (λ/20 for λ=632.8 nm) for camera lenses and microscope objectives.
- Ceramic Sealing Rings: Flatness <0.035 mm for high-pressure hydraulic pumps and nuclear valves.
3. Electronics & New Energy:
- Ceramic Substrates/IGBT Modules: Thickness consistency <3 μm to improve thermal dissipation.
- Lithium Battery Electrodes: Roughness Ra <10 nm to reduce internal resistance and heat generation.
4. Aerospace & Defense:
- Tungsten Steel Bearings/Titanium Seals: Parallelism <2 μm for extreme temperature/pressure environments.
- Infrared Window Glass: Low-scattering properties for telescopes and missile guidance systems.
High-Precision Single-Side Polishing Equipment FAQ
1. Q: What are the key advantages of your high-precision single-side polishing equipment?
A: Achieves sub-micron precision with high efficiency, ideal for silicon wafers, SiC, and sapphire in semiconductor manufacturing.
2. Q: Which semiconductor materials can this single-side polishing machine process?
A: Specifically designed for silicon wafers, silicon carbide (SiC), and sapphire substrates.
Tag: #High-Precision Single-Side Polishing Equipment, #Customized, #Si Wafers/SiC/Sapphire Materials
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