Diamond Wire Single/Multi-Wire Dual-Station Cutting Machine for Sapphire/SiC Material Processing
The diamond wire single/multi-wire dual-station cutting machine is a core equipment for precision processing of brittle materials. By utilizing the high-speed reciprocating motion of diamond wire (steel wire coated with silicon carbide/aluminum oxide particles) and relative abrasion with workpieces, it achieves accurate cutting of hard materials. The "dual-station" design allows simultaneous accommodation of two workpiece fixtures (or alternating operations), significantly enhancing production efficiency. It is widely used for squaring, slicing, and precision shaping of materials such as semiconductor wafers, sapphire, silicon carbide (SiC), ceramics, quartz, and precious metals.
This machine integrates servo control systems, tension regulation, and oscillating cutting technologies, balancing efficiency and precision. It serves as a critical tool in industries like photovoltaics, semiconductors, and advanced manufacturing.
Diamond wire single/multiple wire saw machine technical specifications
| Parameter |
Specification |
| Project |
Single/multiple wire saw |
| Maximum workpiece size |
ø 320*430mm |
| Main roller coating diameter |
ø 210*450mm (Five main rollers) |
| Wire running speed |
1000 (MIX) m/min |
| Diamond wire diameter |
0.2-0.37mm |
| Line storage capacity of supply wheel |
20(0.25mm) diamond wire diameter/km |
| Cutting thickness range |
1.5-80mm |
| Cutting accuracy |
0.01mm |
| Vertical lifting stroke of workstation |
350mm |
| Cutting method |
The workbench swings upwards, but the position of the diamond wire remains unchanged |
| Cutting feed speed |
0.01-10mm/min |
| Water tank |
300L |
| Cutting fluid |
Anti-rust high-efficiency cutting fluid |
| Swing angle |
±8° |
| Swing speed |
0.83°/s |
| Maximum cutting tension |
100N (Set minimum unit 0.1N) |
| Cutting depth |
430mm |
| Workstation |
2 |
| Power supply |
Three-phase five-wire AC380V/50Hz |
| Total power of machine tool |
≤52kW |
| Main motor |
7.5*3kW |
| Wiring motor |
0.75*2kW |
| Workbench swing motor |
1.3*2kW |
| Tension control motor |
4.4*2kW |
| Wire release and collection motor |
5.5*2kW |
| External dimensions (excluding rocker arm box) |
2310*2660*2893mm |
| External dimensions (including rocker arm box) |
2310*2660*2893mm |
| Machine weight |
6000kg |
Working principle of diamond wire single/multiple wire saw machine
The operational logic revolves around "diamond wire abrasion + workpiece feed":
1. Diamond Wire Cycling:
- A high-speed rotating capstan drives the diamond wire in reciprocating linear motion (or unidirectional cycling).
- The wire is tensioned by tension wheels (spring-loaded or pneumatic) to form a stable cutting wire network.
2. Workpiece Feed:
- Servo motors control the workpiece fixture (one in the dual-station setup) to move toward the diamond wire at a constant speed, or vice versa, generating relative abrasion for cutting.
3. Dual-Station Switching:
- After completing one workpiece, the machine automatically switches to the other fixture, enabling continuous operation without downtime.
4. Key Technologies:
- Oscillating Cutting: Models employ a ±8° oscillating worktable to ensure uniform wire contact and improved surface flatness.
- Tension Control: Sensors monitor real-time wire tension, preventing slippage or breakage.
Core features of diamond wire single/multiple wire saw machine
|
Feature
|
Description
|
|
High Efficiency
|
Dual-station design doubles production capacity; high wire speeds reduce cutting time.
|
|
High Precision
|
Servo motors + ball screws ensure ±0.01 mm accuracy; oscillating mode minimizes surface burrs.
|
|
Flexibility
|
Supports single/multi-wire switching and adjustable feed rates (0.01–10 mm/min).
|
|
Eco-Friendliness
|
Uses water-based cutting fluids to reduce dust and noise.
|
|
Stability
|
Cast frameworks enhance rigidity; break-resume function prevents workpiece rejection.
|
Applications of diamond wire single/multiple wire saw machine
The machine is integral to hard material processing across industries:
1. Semiconductors & Photovoltaics:
- Wafer Slicing: Critical for silicon (mono/poly-crystalline) and PERC solar cells.
- Edge Profiling: Ensures uniform thickness for LED substrates and solar modules.
2. Ceramics & Gems:
- Sapphire Processing: Slicing for LED displays and smartphone screens.
- Silicon Carbide (SiC): Precision cutting for EV power devices, minimizing material waste.
3. Quartz & Optical Glass:
- Crystal Oscillators: High-precision slicing for sensors and telecommunications.
- Optical Components: Lens and prism cutting to avoid surface defects.
4. Metals & Rare Earths:
- Precious Metals: Gold/platinum cutting for jewelry, reducing scrap.
- Rare Earth Magnets: NdFeB slicing for motors and sensors.
FAQ of diamond wire single/multiple wire saw machine
1. Q: How does a diamond wire dual-station cutting machine work?
A: It uses diamond wire cycling (reciprocating motion) and dual-station design to enable continuous cutting and material switching, minimizing downtime.
2. Q: What are the key advantages of diamond wire dual-station cutting machines?
A: High efficiency (dual-station parallel processing) and precision (±0.01mm accuracy) for cutting brittle materials like silicon wafers and ceramics.
Tags: #Diamond Wire Single/Multiple Wire Saw Machine, #Semiconductor Wafer Processing, #Sapphire/SiC Material Processing
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