Productdetails
Place of Origin: CHINA
Merknaam: ZMSH
Certificering: rohs
Model Number: 6 Inch Quartz Wafer
Betalings- en verzendvoorwaarden
Minimum Order Quantity: 10
Prijs: by case
Packaging Details: Package in 100-grade cleaning room
Delivery Time: 5-8weeks
Payment Terms: T/T
Supply Ability: 1000pcs per month
Diameter: |
6 inch (150mm) |
Thickness Tolerance: |
±0.02mm |
Total Thickness Variation: |
≤10μm |
Surface Roughness: |
≤0.5nm Ra |
Parallelism: |
≤3μm |
Resistivity: |
>10¹⁶ Ω·cm |
Diameter: |
6 inch (150mm) |
Thickness Tolerance: |
±0.02mm |
Total Thickness Variation: |
≤10μm |
Surface Roughness: |
≤0.5nm Ra |
Parallelism: |
≤3μm |
Resistivity: |
>10¹⁶ Ω·cm |
The 6-inch quartz wafer (150mm diameter) is fabricated from high-purity quartz glass (purity ≥99.999%) with thickness ranging from 50-500μm. Surface roughness is controlled to Ra ≤0.5nm through CMP (Chemical Mechanical Polishing). The manufacturing process includes:
· Raw Material Purification: Extraction of electronic-grade silicon from quartz sand via chlorination and reduction processes, achieving 99.9999% purity.
· Single-Crystal Growth: Cultivation of single-crystal silicon rods using the Czochralski (CZ) method, with defect density <1 defect/cm².
· Cutting and Processing: Slicing silicon rods into 150mm wafers via multi-wire sawing, followed by double-sided polishing and laser etching to ensure thickness tolerance ≤±15μm.
Parameter | Specification |
Diameter | 6 inch (150mm) |
Thickness Range | 0.5mm~3.0mm |
Thickness Tolerance | ±0.02mm |
Total Thickness Variation | ≤10μm |
Surface Roughness (Polished) | ≤0.5nm Ra |
Parallelism | ≤3μm |
CTE (20-300°C) | 0.55×10⁻⁶/°C |
Transmittance @193nm | >92% |
Resistivity | >10¹⁶ Ω·cm |
Vacuum Compatibility | 10⁻¹⁰ Torr |
Flexural Strength (Strengthened) | 500-700MPa |
The 6-inch quartz wafer is a circular thin film made of high-purity quartz material, widely used in semiconductor manufacturing, optoelectronics, and precision optics. Key features include:
· High Purity and Thermal Resistance: Quartz glass purity ≥99.999%, softening point ~1730°C, short-term tolerance up to 1450°C.
· Low Thermal Expansion: Thermal expansion coefficient 0.5×10⁻⁶/°C (25-300°C), capable of withstanding thermal shock (ΔT ≥800°C).
· Chemical Stability: Resists corrosion from all acids except hydrofluoric acid, with corrosion resistance 30× higher than ceramics and 150× higher than stainless steel.
· Optical Performance: High transmittance in the ultraviolet to near-infrared spectrum (visible light >93%, near-infrared >95%).
· Mechanical Strength: Mohs hardness of 7, compressive strength superior to standard glass.
1. Semiconductor Manufacturing: Used in diodes, transistors, and MOSFETs, supporting automotive electronics and power semiconductors.
2. Optoelectronics: Serves as substrates for optical fibers, laser devices, and waveguides in 5G networks and data centers.
3. Precision Optics: Applied in infrared imaging systems, laser optics, and high-transmittance lenses.
4. Sensors and Instruments: Core components in MEMS sensors and medical diagnostic equipment.
5. Aerospace: High-temperature optical windows and heat-resistant components for spacecraft.
Quartz tubes are high-purity quartz glass fabricated into tubular structures, widely used in semiconductor diffusion/oxidation processes and photovoltaic equipment. Our services include:
· Custom Processing: Inner diameters (5-50mm), lengths (100-1000mm), and wall thicknesses (0.5-3mm). Complex geometries (bent, multi-chamber tubes) are supported.
· Technical Advantages: Operates at 1100°C long-term, low hydroxyl content (<1ppm), and high contamination resistance, meeting semiconductor-grade cleanliness requirements.
1. Q: What are the primary applications of 6-inch quartz wafers?
A: 6-inch quartz wafers are widely used in semiconductor manufacturing (e.g., diodes, MOSFETs), optoelectronics (fiber optics, lasers), and precision sensors due to their high thermal stability and optical transparency .
2. Q: What challenges exist in 6-inch quartz wafer production?
A: Key challenges include maintaining ultra-high purity (>99.999% SiO₂), minimizing defects during crystal growth, and ensuring uniformity in slicing/polishing processes .
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